| |
20 Advantages of Vapor Phase Reflow Soldering
- No need for setting up temperature profiles since condensing vapor transfers the heat.
- It's impossible to heat up the components higher than the temperature of the condensing vapor (e.g. 200°C or lead-free soldering of SnAg3, 5 with 230°C). Therefore no overheating can occur.
- Trouble free single circuit board assembly manufacturing
- Processing conditions are absolutely reproducible, even in long-term
- Uniform temperature distribution across the entire PCB.
- Delaminating of circuit boards will not occur.
- The vapor provides a 100% inert gas atmosphere.
- All components can be reliably soldered (including all kinds of BGA).
- Due to the low maximum temperature of 200°C the danger of popcorn cracking is minimized.
- Optional preheat on top or below the PCB.
- Repair is easy. Desoldering is accomplished without damaging the PCB or components (even QFP320 or all kinds of BGAs or CGAs).
- Low operating costs due to minimized liquid agent drag out.
- Integrated cooling system based on air convection.
- Optional rapid cooling system for minimizing the growth of intermetallic phases. Even heavy boards can be cooled up to 5 K/sec for a fast temperature drop below the solidification temperature of the solder.
- Environmental compatible soldering process because there are less aggressive flux vapors than in other reflow procedures.
- Window for observation of the soldering process.
- Only vapor phase soldering fulfils 100% of ISO 9000 requirements.
- After 15-20 minutes the machines are ready for soldering.
- Currently the most cost effective reflow soldering process.
- Optional: Void free vacuum soldering in vapor phase. (Patented)
|
|
